JPH0122976B2 - - Google Patents
Info
- Publication number
- JPH0122976B2 JPH0122976B2 JP58036302A JP3630283A JPH0122976B2 JP H0122976 B2 JPH0122976 B2 JP H0122976B2 JP 58036302 A JP58036302 A JP 58036302A JP 3630283 A JP3630283 A JP 3630283A JP H0122976 B2 JPH0122976 B2 JP H0122976B2
- Authority
- JP
- Japan
- Prior art keywords
- forming
- etching
- anode
- oxide film
- conductive layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000005530 etching Methods 0.000 claims description 15
- 239000003990 capacitor Substances 0.000 claims description 13
- 239000011888 foil Substances 0.000 claims description 10
- 229910052751 metal Inorganic materials 0.000 claims description 10
- 239000002184 metal Substances 0.000 claims description 10
- 238000000034 method Methods 0.000 claims description 10
- 238000004519 manufacturing process Methods 0.000 claims description 4
- 239000010407 anodic oxide Substances 0.000 claims description 3
- 229920002120 photoresistant polymer Polymers 0.000 claims description 3
- 229910000679 solder Inorganic materials 0.000 claims description 3
- 238000010030 laminating Methods 0.000 claims description 2
- 238000001035 drying Methods 0.000 claims 1
- 230000001678 irradiating effect Effects 0.000 claims 1
- 239000002966 varnish Substances 0.000 description 5
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 4
- 230000003647 oxidation Effects 0.000 description 4
- 238000007254 oxidation reaction Methods 0.000 description 4
- 239000004065 semiconductor Substances 0.000 description 4
- 239000011347 resin Substances 0.000 description 3
- 229920005989 resin Polymers 0.000 description 3
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 239000007864 aqueous solution Substances 0.000 description 2
- 239000010953 base metal Substances 0.000 description 2
- 229910052799 carbon Inorganic materials 0.000 description 2
- 238000009826 distribution Methods 0.000 description 2
- 229910002804 graphite Inorganic materials 0.000 description 2
- 239000010439 graphite Substances 0.000 description 2
- NUJOXMJBOLGQSY-UHFFFAOYSA-N manganese dioxide Chemical compound O=[Mn]=O NUJOXMJBOLGQSY-UHFFFAOYSA-N 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- 229910052758 niobium Inorganic materials 0.000 description 2
- 239000010955 niobium Substances 0.000 description 2
- GUCVJGMIXFAOAE-UHFFFAOYSA-N niobium atom Chemical compound [Nb] GUCVJGMIXFAOAE-UHFFFAOYSA-N 0.000 description 2
- 239000003960 organic solvent Substances 0.000 description 2
- 238000005507 spraying Methods 0.000 description 2
- 229910052715 tantalum Inorganic materials 0.000 description 2
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 2
- 239000010936 titanium Substances 0.000 description 2
- 229910052719 titanium Inorganic materials 0.000 description 2
- 229920002554 vinyl polymer Polymers 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- BTBUEUYNUDRHOZ-UHFFFAOYSA-N Borate Chemical compound [O-]B([O-])[O-] BTBUEUYNUDRHOZ-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- XSTXAVWGXDQKEL-UHFFFAOYSA-N Trichloroethylene Chemical group ClC=C(Cl)Cl XSTXAVWGXDQKEL-UHFFFAOYSA-N 0.000 description 1
- 238000003486 chemical etching Methods 0.000 description 1
- 229940114081 cinnamate Drugs 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 238000000866 electrolytic etching Methods 0.000 description 1
- 238000001017 electron-beam sputter deposition Methods 0.000 description 1
- 238000010304 firing Methods 0.000 description 1
- 239000003779 heat-resistant material Substances 0.000 description 1
- 238000005470 impregnation Methods 0.000 description 1
- 229940099596 manganese sulfate Drugs 0.000 description 1
- 235000007079 manganese sulphate Nutrition 0.000 description 1
- 239000011702 manganese sulphate Substances 0.000 description 1
- MIVBAHRSNUNMPP-UHFFFAOYSA-N manganese(2+);dinitrate Chemical compound [Mn+2].[O-][N+]([O-])=O.[O-][N+]([O-])=O MIVBAHRSNUNMPP-UHFFFAOYSA-N 0.000 description 1
- SQQMAOCOWKFBNP-UHFFFAOYSA-L manganese(II) sulfate Chemical compound [Mn+2].[O-]S([O-])(=O)=O SQQMAOCOWKFBNP-UHFFFAOYSA-L 0.000 description 1
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 1
- 229910052753 mercury Inorganic materials 0.000 description 1
- -1 organic acid salt Chemical class 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 238000010025 steaming Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
- 229910052724 xenon Inorganic materials 0.000 description 1
- FHNFHKCVQCLJFQ-UHFFFAOYSA-N xenon atom Chemical compound [Xe] FHNFHKCVQCLJFQ-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Electrolytic Production Of Non-Metals, Compounds, Apparatuses Therefor (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58036302A JPS59161808A (ja) | 1983-03-04 | 1983-03-04 | 電解コンデンサの製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58036302A JPS59161808A (ja) | 1983-03-04 | 1983-03-04 | 電解コンデンサの製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS59161808A JPS59161808A (ja) | 1984-09-12 |
| JPH0122976B2 true JPH0122976B2 (en]) | 1989-04-28 |
Family
ID=12466020
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP58036302A Granted JPS59161808A (ja) | 1983-03-04 | 1983-03-04 | 電解コンデンサの製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS59161808A (en]) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6362888A (ja) * | 1986-09-01 | 1988-03-19 | Showa Alum Corp | 電解コンデンサ用アルミニウム電極材 |
| JPS63157882A (ja) * | 1986-09-03 | 1988-06-30 | Showa Alum Corp | 電解コンデンサ用アルミニウム電極材の製造方法 |
| JPS63239917A (ja) * | 1987-03-27 | 1988-10-05 | 日通工株式会社 | 積層型固体電解コンデンサ及びその製造方法 |
| JP5128053B2 (ja) * | 2004-04-27 | 2013-01-23 | 昭和電工株式会社 | コンデンサ用電極箔の製造方法、コンデンサ用電極箔、積層型電解コンデンサ及び巻回型電解コンデンサ |
| CN1993786B (zh) * | 2004-08-05 | 2010-06-16 | 松下电器产业株式会社 | 电容器用铝电极箔的制造方法以及蚀刻用铝箔 |
| CN102422370A (zh) * | 2009-05-12 | 2012-04-18 | 日本轻金属株式会社 | 电解电容器用铝电极板的制造方法 |
| CN115769322A (zh) * | 2020-07-07 | 2023-03-07 | 松下知识产权经营株式会社 | 固体电解电容器元件和固体电解电容器及其制造方法 |
-
1983
- 1983-03-04 JP JP58036302A patent/JPS59161808A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS59161808A (ja) | 1984-09-12 |
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